Name: PowerEdge 1855 Fan Assembly
Brand: Dell
Price: 62.95 USD
Availability: InStock

Dell 0KC228 PowerEdge 1855 Fan Assembly

The Dell PowerEdge 1855 Fan Assembly (part number 0KC228) is a high-performance cooling component designed specifically for Dell PowerEdge servers. Engineered to deliver reliable airflow and maintain optimal operating temperatures, this fan assembly ... Read More

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$62.95

Ships from outside of the USA. Please allow up to 3 weeks for delivery.

In Stock: 3
Manufacturer: Dell
Model or Part: 0KC228
Condition: Refurbished
Weight: 3.00lb

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Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview
The Dell PowerEdge 1855 Fan Assembly (part number 0KC228) is a high-performance cooling component designed specifically for Dell PowerEdge servers. Engineered to deliver reliable airflow and maintain optimal operating temperatures, this fan assembly helps protect critical server components from overheating and ensures consistent system performance in demanding data center environments.

Key Features

Precision balanced impeller for quiet, vibration-free operation
High static pressure design to move air through dense server chassis
Durable, long-life bearings rated for continuous 24/7 use
Standard 12V DC power input for easy integration with existing server power supplies
Plug-and-play connector eliminates the need for complex wiring

Technical Specifications

Model/Part Number: 0KC228
Manufacturer: Dell
Voltage: 12 V DC
Current Draw: approx 0.5 A (typical)
Airflow: 45 CFM (cubic feet per minute) at full speed
Static Pressure: 1.2 inH2O (approx 300 Pa)
Operating Temperature Range: 0 to 55 degrees Celsius
Noise Level: less than 30 dBA at full speed
Dimensions: 120 mm x 120 mm x 30 mm (L x W x H)
Connector Type: 4-pin Molex compatible

Applications
This fan assembly is ideal for use in Dell PowerEdge rack and tower servers, including models that require enhanced cooling for high-density processor and memory configurations. It is suitable for data centers, enterprise IT rooms, and any environment where reliable thermal management is critical to maintain uptime and protect valuable hardware investments.