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Extreme Networks 17112 Fan Module for Summit X670 Series Switches, Back-to-Front airflo

Extreme Networks 17112 Fan Module for Summit X670 Series Switches, Back-to-Front airflo
Extreme Networks 17112 Fan Module for Summit X670 Series Switches, Back-to-Front airflo
The Extreme Networks 17112 Fan Module is engineered for the Summit X670 series switches and provides reliable back-to-front airflow to keep critical network equipment operating at optimal temperature. Designed for high-density data centre environment... Read More
price
$49.95
  • In Stock: 10
  • Manufacturer: Extreme Networks
  • Model or Part: 17112
  • Condition: New
  • Weight: 1.00lb
  • Dimensions: 14.00in x 11.00in x 3.00in
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Overview

The Extreme Networks 17112 Fan Module is engineered for the Summit X670 series switches and provides reliable back-to-front airflow to keep critical network equipment operating at optimal temperature. Designed for high-density data centre environments, this fan module delivers consistent cooling performance while maintaining low noise levels, helping to extend the life of your switching hardware and reduce downtime caused by overheating.

Key Features

  • Back-to-front airflow direction matches the internal layout of Summit X670 switches
  • High efficiency brushless DC motor for reduced power consumption
  • Quiet operation with acoustic rating below 45 dB(A) at full speed
  • Hot-swap capability allows replacement without shutting down the switch
  • Integrated speed control integrates with the switch management software for dynamic cooling
  • Compact form factor fits within the existing chassis without additional space requirements

Technical Specifications

  • Model number: 17112
  • Compatible devices: Summit X670 series switches
  • Airflow direction: Back to front
  • Airflow rate: 85 CFM (cubic feet per minute) typical
  • Operating temperature range: 0-40 deg C
  • Power consumption: 12 W max
  • Connector type: Standard 4-pin fan connector
  • Mounting: Tool-less slide-in rail

Typical Applications

  • Enterprise data centre core and aggregation layers
  • High-performance computing clusters requiring stable thermal management
  • Carrier grade networking equipment where uptime is critical
  • Campus and branch office deployments with limited cooling infrastructure
  • Any environment that uses Extreme Networks Summit X670 switches and needs reliable, efficient cooling