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- In Stock: 26
- Manufacturer: HP
- Model or Part: 511659-001
- Condition: Refurbished
- Weight: 1.00lb
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Item Condition
New - Sealed or Open Box ConditionExcellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item
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Overview
The HP BL685c G6 Heatsink Processor 3 and 4 is a high performance thermal management component designed for HP ProLiant Gen6 servers. Engineered to keep critical processors cool under heavy workloads, this heatsink ensures reliable operation and extends the life of your server hardware. Its precision-engineered fins and integrated heat pipes provide efficient heat dissipation, making it an essential upgrade for data centers, cloud environments and enterprise applications that demand continuous uptime.
Key Features
- Optimized fin design for maximum airflow and heat removal
- Integrated heat pipe technology for rapid heat transfer
- Direct fit for HP BL685c G6 server models without modification
- Durable construction with high quality aluminum alloy
- Lightweight yet robust for easy installation and serviceability
Technical Specifications
- Compatible Models: HP BL685c G6 servers, processor slots 3 and 4
- Material: Aluminum alloy fins with copper heat pipe core
- Dimensions (L x W x H): 150 mm x 120 mm x 45 mm
- Weight: Approx 0.8 kg
- Operating Temperature Range: 0 to 85 deg Celsius
- Airflow Requirement: 30 CFM minimum for optimal performance
Applications
- Enterprise data center servers requiring high reliability
- Virtualization hosts running multiple virtual machines
- High performance computing (HPC) clusters
- Cloud service platforms with intensive processing loads
- Any HP ProLiant Gen6 system where processor cooling is critical
Upgrade your server with the HP BL685c G6 Heatsink Processor 3 and 4 to maintain optimal thermal performance, reduce the risk of overheating, and ensure consistent system stability even during peak processing demands.