IBM 09P5866 Dual Fan Assy, Pci, P630/7028

IBM 09P5866 Dual Fan Assy, Pci, P630/7028
IBM 09P5866 Dual Fan Assy, Pci, P630/7028
The IBM Dual Fan Assembly part number 09P5866 is a high performance cooling solution designed for IBM Power Systems models P630 and 7028. This PCI mounted fan assembly provides reliable, continuous airflow to critical components, helping to maintain ... Read More
price
$29.95

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  • In Stock: 4
  • Manufacturer: IBM
  • Model or Part: 09P5866
  • Condition: Refurbished
  • Weight: 1.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview

The IBM Dual Fan Assembly part number 09P5866 is a high performance cooling solution designed for IBM Power Systems models P630 and 7028. This PCI mounted fan assembly provides reliable, continuous airflow to critical components, helping to maintain optimal operating temperatures in demanding data center environments. Engineered with precision bearings and a robust housing, the unit delivers quiet yet powerful cooling, extending the life of server processors, memory modules and other heat sensitive hardware.

Key Features

  • Dual fan configuration for balanced airflow and redundancy
  • PCI form factor for easy installation in standard server chassis
  • High static pressure design to overcome dense component layouts
  • Low noise operation suitable for noise sensitive facilities
  • Durable construction with metal housing and sealed bearings
  • Compatible with IBM Power System P630 and 7028 models

Technical Specifications

  • Model / Part Number: 09P5866
  • Fan size: 80 mm x 80 mm
  • Airflow: up to 50 CFM per fan
  • Static pressure: 0.8 inH2O
  • Operating voltage: 12 V DC
  • Current draw: 0.5 A per fan
  • Operating temperature range: 0 deg C to 50 deg C
  • Connector type: 4 pin Molex
  • Mounting: PCI slot with retention brackets

Applications

This dual fan assembly is ideal for use in high density servers, virtualization platforms, and enterprise workloads that generate significant heat. It is commonly deployed in:

  • Database and analytics servers
  • Virtual machine hosts
  • High performance computing clusters
  • Mission critical applications requiring continuous uptime
  • Environments where thermal management is a priority

By delivering consistent cooling performance, the IBM Dual Fan Assembly helps ensure system stability, reduces the risk of thermal throttling, and supports the reliable operation of your most important workloads.