IBM 12R6732 Air Flow Filler. P5-590

IBM 12R6732 Air Flow Filler. P5-590
IBM 12R6732 Air Flow Filler. P5-590
The IBM Air Flow Filler P5-590 (part number 12R6732) is a precision engineered component designed to optimise airflow management in high performance computing and data centre environments. This filler helps maintain consistent pressure differentials,... Read More
price
$74.95

Ships next business day.

  • In Stock: 1
  • Manufacturer: IBM
  • Model or Part: 12R6732
  • Condition: Refurbished
  • Weight: 1.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview
The IBM Air Flow Filler P5-590 (part number 12R6732) is a precision engineered component designed to optimise airflow management in high performance computing and data centre environments. This filler helps maintain consistent pressure differentials, reduces turbulence, and protects sensitive equipment from dust and debris while ensuring efficient cooling.

Key Features

  • Robust construction using high grade polymer for long term durability
  • Low profile design that fits seamlessly into standard IBM rack and chassis configurations
  • Easy installation with snap-fit mounting clips
  • Provides a sealed pathway to minimise air leakage and improve thermal efficiency
  • Compatible with a wide range of IBM server models and third party hardware

Technical Specifications

  • Part Number: 12R6732
  • Model: Air Flow Filler P5-590
  • Material: High impact polymer
  • Dimensions (L x W x H): 120 mm x 30 mm x 15 mm
  • Operating Temperature Range: -20 deg C to 70 deg C
  • Weight: 0.12 kg
  • Compliance: RoHS and REACH

Applications
The Air Flow Filler is ideal for use in data centre racks, blade server enclosures, and high density compute clusters where precise airflow control is critical. It is also suitable for telecom equipment cabinets, networking gear housings, and any environment that requires reliable dust protection while maintaining optimal cooling performance.