Name: Fan Heat Sink Assembly 6224-38u
Brand: IBM
Price: 55.95 USD
Availability: InStock

IBM 13N2474 Fan Heat Sink Assembly 6224-38u

The IBM Fan Heat Sink Assembly 6224-38u (part number 13N2474) is a high-performance cooling solution designed for demanding server and mainframe environments. Engineered to dissipate heat efficiently from critical components, this assembly combines a... Read More

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$55.95

In Stock: 1
Manufacturer: IBM
Model or Part: 13N2474
Condition: Refurbished
Weight: 1.00lb

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Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview
The IBM Fan Heat Sink Assembly 6224-38u (part number 13N2474) is a high-performance cooling solution designed for demanding server and mainframe environments. Engineered to dissipate heat efficiently from critical components, this assembly combines a precision-machined aluminum heat sink with a low-noise, high-flow fan. It helps maintain optimal operating temperatures, extending the life of your equipment and ensuring reliable performance under continuous load.

Key Features

Robust aluminum heat sink with optimized fin geometry for maximum thermal transfer
Quiet 120 mm fan rated at 4000 RPM for high airflow without excessive noise
Integrated mounting brackets for quick installation on compatible IBM chassis
Durable fan blades designed for long service life and resistance to vibration
Standard 12 V DC power input for easy integration with existing power supplies

Technical Specifications

Model / Part Number: 13N2474
Heat sink dimensions: 62 mm x 24 mm x 38 mm (L x W x H)
Fan size: 120 mm x 120 mm x 25 mm
Airflow: 70 CFM (cubic feet per minute)
Static pressure: 1.2 in H2O
Operating temperature range: 0 deg to 70 deg C
Power consumption: 4.5 W
Connector type: 4-pin Molex compatible

Applications
The Fan Heat Sink Assembly 6224-38u is ideal for use in IBM Power servers, high-density blade systems, and other enterprise hardware where efficient heat removal is critical. It is also suitable for retrofitting older IBM platforms that require upgraded cooling to support newer, higher-performance processors and memory modules. By delivering consistent thermal management, this assembly helps prevent overheating, reduces system downtime, and supports sustained high-performance computing workloads.