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- In Stock: 50
- Manufacturer: IBM
- Model or Part: 26K8083
- Condition: Refurbished
- Weight: 1.00lb
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Item Condition
New - Sealed or Open Box ConditionExcellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item
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Overview
IBM part number 26K8083 is a dual fan assembly designed specifically for the IBM System x3620 and x3630 M3 servers. This high-performance cooling solution replaces the original fan unit with a reliable, easy-to-install module that maintains optimal airflow and temperature control for critical processor and chipset components. Built to IBM specifications, the assembly ensures quiet operation while delivering the airflow needed for demanding data-center environments.
Key Features
- Dual fan configuration for balanced airflow across the system board
- Precision-engineered blades provide up to 50 CFM of airflow per fan
- Low noise operation at 30 dBA typical
- Standard 4-pin PWM connector for dynamic speed control
- Compatible with IBM System x3620 and x3630 M3 chassis only
- Plug-and-play design eliminates the need for additional tools
Technical Specifications
- Model / Part Number: 26K8083
- Fan size: 80 mm x 80 mm x 25 mm
- Voltage: 12 V DC
- Current draw: 0.45 A per fan
- Operating speed: 3000 RPM +/- 10 percent
- Airflow: 50 CFM per fan
- Noise level: 30 dBA
- Connector type: 4-pin PWM
- Operating temperature range: 0 deg to 50 deg C
- Dimensions (assembly): 80 mm x 80 mm x 50 mm (height includes both fans)
Applications
This dual fan assembly is ideal for:
- Enterprise servers requiring reliable thermal management
- Virtualization hosts that run multiple CPUs and memory modules
- High-density rack environments where space and cooling efficiency are critical
- Replacement or upgrade projects for aging IBM x3620/x3630 M3 systems
- Any scenario where maintaining system uptime and performance is a priority
By installing the IBM 26K8083 dual fan assembly, you ensure that your server maintains the temperature stability needed for maximum performance, reduces the risk of thermal throttling, and extends the life of your critical hardware components.