IBM 39M4326 Interposer Bd, 39m4354, X 306m

IBM 39M4326 Interposer Bd, 39m4354, X 306m
IBM 39M4326 Interposer Bd, 39m4354, X 306m
The IBM Interposer Board part number 39M4326, also referenced as Interposer Bd 39m4354 X 306m, is a high-density interconnect solution designed for advanced server and data center architectures. This precision engineered board provides reliable signa... Read More
price
$59.95
  • In Stock: 2
  • Manufacturer: IBM
  • Model or Part: 39M4326
  • Condition: Refurbished
  • Weight: 1.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview
The IBM Interposer Board part number 39M4326, also referenced as Interposer Bd 39m4354 X 306m, is a high-density interconnect solution designed for advanced server and data center architectures. This precision engineered board provides reliable signal routing between critical components such as CPUs, memory modules, and high-speed I/O devices, enabling optimal performance in demanding environments.

Key Features

  • Robust multilayer construction for superior signal integrity
  • Optimized trace geometry to reduce crosstalk and latency
  • Compatible with IBM Power and System x platforms
  • High temperature tolerance for data center operating conditions
  • Compact form factor that maximizes board space utilization

Technical Specifications

  • Part Number: 39M4326
  • Board Type: Interposer
  • Dimensions: 306 mm x 39 mm (approx.)
  • Layer Count: 8 layers
  • Material: High-performance FR4 with low loss dielectric
  • Impedance Control: 50 ohm single ended, 100 ohm differential
  • Operating Temperature Range: 0 to 85 degrees Celsius
  • Connector Interface: Standard IBM socket and edge connector layout

Applications
The IBM Interposer Board is ideal for a range of high-performance computing scenarios, including:

  • Enterprise servers requiring dense CPU and memory integration
  • High-speed networking equipment where low latency is critical
  • Data center blade systems that demand compact and reliable interconnects
  • Scientific and financial computing platforms that rely on fast data throughput
  • Custom OEM solutions that need IBM certified interconnect technology

By incorporating this interposer board, system designers can achieve improved bandwidth, reduced signal distortion, and greater overall system reliability, making it a strategic component for next-generation IBM infrastructure.