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- In Stock: 1
- Manufacturer: IBM
- Model or Part: 60H2212
- Condition: Refurbished
- Weight: 20.00lb
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Item Condition
New - Sealed or Open Box ConditionExcellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item
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Overview
The IBM P590 Processor Backplane (part number 60H2212) is a high-density interconnect solution designed for IBM Power Systems servers. Engineered to provide reliable, low-latency communication between the central processing units and peripheral modules, this backplane supports demanding enterprise workloads while maintaining a compact footprint. Its robust construction and precision engineering make it an essential component for data center environments that require maximum uptime and performance.
Key Features
- Optimized signal integrity for high-speed data paths
- Modular design enables easy installation and serviceability
- Enhanced thermal management with built-in heat dissipation channels
- Compatible with IBM Power 590, 570 and related server platforms
- Supports up to 64 processor sockets per backplane
- Built to IBM quality standards for reliability and longevity
Technical Specifications
- Model/Part Number: 60H2212
- Form factor: 19 inch rack mount, 2U height
- Connector type: High-density PCIe 3.0 x16 slots
- Maximum power handling: 1500 watts
- Operating temperature range: 0 to 40 degrees Celsius
- Environmental compliance: RoHS, WEEE
- Material: High-grade aluminum alloy with epoxy coating
Applications
- Enterprise data centers requiring scalable compute resources
- High-performance computing (HPC) clusters for scientific research
- Financial services platforms that demand low latency processing
- Cloud service providers building dense server farms
- Virtualization environments with heavy VM density
By integrating the IBM P590 Processor Backplane into your server architecture, you gain a reliable foundation that maximizes processor performance, simplifies system upgrades, and reduces overall maintenance costs.