Name: BladeCenter H Enhanced Cooling Module
Brand: IBM
Price: 351.95 USD
Availability: InStock

IBM 68Y6650 BladeCenter H Enhanced Cooling Module

The IBM BladeCenter H Enhanced Cooling Module (part number 68Y6650) is a high-performance thermal solution designed to keep BladeCenter H chassis operating at optimal temperatures even under heavy workloads. By delivering increased airflow and precis... Read More

price

$351.95

Ships next business day.

In Stock: 50
Manufacturer: IBM
Model or Part: 68Y6650
Condition: Refurbished
Weight: 11.02lb
Dimensions: 16.50in x 15.50in x 15.00in

Qty

Add to Cart

Buy Now

Add to Wish List

Shipping Information

United States Shipping

Orders over $200 qualify for Free Super-Saver Shipping! We ship at our discretion via the most cost-effective method using FedEx, UPS, or USPS.

To ensure your order is processed efficiently, all shipping charges must be pre-paid at checkout. We are unable to bill directly to third-party shipper accounts or use customer-provided labels for domestic shipments.

International Shipping

International orders begin processing as soon as payment is confirmed.

Pre-paid Shipping: For your convenience, you can select and pay for international shipping directly at checkout.
Carrier Accounts: Alternatively, we can bill transport costs directly to your FedEx account number. (Note: We cannot bill to DHL, TNT, or UPS accounts).
Customer Labels: We are also happy to ship internationally using pre-paid labels provided by you for any carrier.

Expedited and Rush Shipping

Need it faster? HardwareJet.com offers 1 or 2-day expedited shipping options during checkout for eligible items.

To get your order to the front of the line, expedited orders include a small rush fee in addition to the carrier's shipping charges. If an item is not available for expedited shipping, these options will not appear in your cart.

Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

To bring you an even wider selection, some of our items are shipped directly from our trusted partners. Delivery times may vary for these items.

Description

Overview
The IBM BladeCenter H Enhanced Cooling Module (part number 68Y6650) is a high-performance thermal solution designed to keep BladeCenter H chassis operating at optimal temperatures even under heavy workloads. By delivering increased airflow and precise temperature control, this module helps maintain system reliability, reduce component wear, and support higher density deployments without the need for additional external cooling equipment.

Key Features

Optimized airflow design that delivers up to 30 percent more cooling capacity compared to standard modules
Quiet fan operation with variable speed control for energy efficient performance
Easy slide-in installation that requires no tools or system downtime
Integrated temperature sensors that work with IBM management software for real-time monitoring
Compact form factor that fits within the BladeCenter H chassis without sacrificing blade slot availability

Technical Specifications

Model/Part Number: 68Y6650
Compatible chassis: IBM BladeCenter H
Cooling capacity: up to 1200 CFM (cubic feet per minute)
Operating temperature range: 0 deg to 50 deg Celsius
Power consumption: 45 Watts maximum per module
Fan speed range: 1200 RPM to 3600 RPM
Connector type: Standard IBM BladeCenter H cooling connector
Dimensions: 2U height, fits within chassis envelope

Applications

Data center racks that require high density blade deployments
Virtualization environments with sustained CPU and memory intensive workloads
High performance computing clusters where thermal stability is critical
Enterprise servers that run 24/7 and need reliable cooling without frequent maintenance
Any IBM BladeCenter H installation seeking to improve energy efficiency and extend hardware lifespan