Name: HS XMT BP X0415 D Circuit Board
Brand: NEC
Price: 155.95 USD
Availability: InStock

NEC M3CPUO11AB HS XMT BP X0415 D Circuit Board

price

$155.95

In Stock: 1
Manufacturer: NEC
Model or Part: M3CPUO11AB
Condition: Refurbished
Weight: 4.00lb
Dimensions: 10.00in x 5.00in x 3.00in

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Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview

The NEC HS XMT BP X0415 D Circuit Board (part number M3CPUO11AB) is a high-performance printed circuit board designed for use in advanced telecommunications and data processing equipment. Engineered with precision layout and robust materials, this board delivers reliable signal integrity and thermal stability in demanding environments. Its compact form factor and versatile connector options make it an ideal replacement or upgrade for legacy systems that require modern performance without extensive redesign.

Key Features

High density routing for complex signal pathways
Optimized copper thickness for low impedance and reduced signal loss
Thermal management design with built-in heat dissipation features
Compatible with NEC HS XMT series chassis and backplane configurations
Surface mount and through-hole component support for flexible assembly
Conformal coating ready for harsh industrial conditions

Technical Specifications

Model/Part Number: M3CPUO11AB
Board dimensions: 120 mm x 80 mm (approx.)
Layer count: 8 layers
Copper weight: 1 oz per square foot
Dielectric material: FR4, Tg 130 deg C
Operating temperature range: -40 to 85 deg C
Maximum voltage rating: 50 V
Connector type: Standard NEC backplane edge connector

Applications

Telecom switching equipment
Data center networking modules
Industrial control systems
High-speed signal processing units
Legacy system refurbishment and upgrades
Custom embedded solutions requiring reliable high-frequency performance

Choose the NEC HS XMT BP X0415 D Circuit Board for a dependable, high-quality component that enhances system reliability, reduces downtime, and supports the rigorous demands of modern communication infrastructure.