Sun Microsystems F373-0021 Front I/O Board I/O Assembly

Sun Microsystems F373-0021 Front I/O Board I/O Assembly
Sun Microsystems F373-0021 Front I/O Board I/O Assembly
The Sun Microsystems Front I/O Board I/O Assembly (model F373-0021) is a high-performance interface module designed to expand the connectivity options of Sun server platforms. Engineered for reliability and ease of installation, this board provides a... Read More
price
$659.95
  • In Stock: 1
  • Manufacturer: Sun Microsystems
  • Model or Part: F373-0021
  • Condition: Refurbished
  • Weight: 3.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview

The Sun Microsystems Front I/O Board I/O Assembly (model F373-0021) is a high-performance interface module designed to expand the connectivity options of Sun server platforms. Engineered for reliability and ease of installation, this board provides a comprehensive set of ports that enable seamless integration of storage, networking, and peripheral devices in demanding data center environments.

Key Features

  • Integrated front panel connectors for rapid access and serviceability
  • Supports multiple high-speed serial and parallel interfaces
  • Robust design with built-in error detection and correction
  • Compatible with a wide range of Sun server models
  • Hot-swap capable for minimal downtime during upgrades

Technical Specifications

  • Part Number: F373-0021
  • Form Factor: Full height, half depth PCI board
  • Power Consumption: 45 watts typical
  • Operating Temperature: 0 deg to 55 deg C
  • Supported Bus: PCI 2.2 compliant
  • Connector Types: 2 x 8 pin SCSI, 2 x 10/100/1000 Ethernet, 2 x USB 2.0, 1 x VGA, 1 x Serial RS-232
  • Dimensions: 10.5 in x 9.0 in (approx.)

Applications

  • Enterprise server expansion for additional storage and network links
  • High-availability clusters requiring reliable front panel access
  • Virtualization hosts that need multiple I/O paths for VM traffic
  • Data center environments where hot-swap capability reduces maintenance windows
  • Research and development labs that demand flexible peripheral connectivity