Name: High Efficiency Screw-Down Type Heatsink Assembly
Brand: HP
Price: 75.95 USD
Availability: InStock

HP 775404-001 High Efficiency Screw-Down Type Heatsink Assembly

Overview The HP 775404-001 High Efficiency Screw-Down Type Heatsink Assembly is a precision engineered thermal solution designed to keep high performance processors and graphics modules operating within optimal temperature ranges. Built with a robust... Read More

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$75.95

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In Stock: 146
Manufacturer: HP
Model or Part: 775404-001
Condition: Refurbished
Weight: 2.00lb

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Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview
The HP 775404-001 High Efficiency Screw-Down Type Heatsink Assembly is a precision engineered thermal solution designed to keep high performance processors and graphics modules operating within optimal temperature ranges. Built with a robust copper base and an array of finely spaced aluminum fins, this heatsink delivers superior heat dissipation while maintaining a low profile that fits easily into compact workstation and server chassis.

Key Features

High conductivity copper base for rapid heat transfer
Fin density optimized for maximum airflow and low acoustic output
Screw-down mounting system provides secure, repeatable installation
Compatible with standard HP server and workstation CPU sockets
Lightweight aluminum fin construction reduces overall system weight
Easy to clean design minimizes maintenance downtime

Technical Specifications

Part Number: 775404-001
Base material: Copper
Fin material: Aluminum
Dimensions (L x W x H): 120 mm x 120 mm x 35 mm
Maximum operating temperature: 85 deg C
Mounting type: Screw-down
Weight: 0.45 kg
Thermal resistance: 0.35 deg C/W

Applications
The HP High Efficiency Screw-Down Type Heatsink Assembly is ideal for use in enterprise servers, high-end workstations, and compute nodes that demand reliable thermal performance. It is especially suited for processors with high power draw, graphics accelerators, and other heat generating components in data center environments, scientific computing clusters, and professional rendering stations.