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HP 491101-001 Cpu Heatsink (dl785 G5/g6)
The HP Cpu Heatsink (part number 491101-001) is engineered for the HP ProLiant DL785 G5 and G6 servers. Designed to deliver reliable thermal management, this heatsink maintains optimal processor temperatures under demanding workloads, helping to exte... Read More
price
$24.95
- In Stock: 5
- Manufacturer: HP
- Model or Part: 491101-001
- Condition: Refurbished
- Weight: 3.00lb
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Item Condition
New - Sealed or Open Box ConditionExcellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item
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Overview
The HP Cpu Heatsink (part number 491101-001) is engineered for the HP ProLiant DL785 G5 and G6 servers. Designed to deliver reliable thermal management, this heatsink maintains optimal processor temperatures under demanding workloads, helping to extend system life and improve performance stability.
Key Features
- Precision machined aluminum base for efficient heat transfer
- High fin density design maximizes surface area for rapid cooling
- Secure mounting brackets compatible with DL785 G5 and G6 chassis
- Optimized airflow channels work seamlessly with standard server fans
- Durable construction resists corrosion and mechanical stress
Technical Specifications
- Manufacturer: HP
- Model/Part Number: 491101-001
- Compatible Server Models: ProLiant DL785 G5, ProLiant DL785 G6
- Base Material: Aluminum alloy
- Fin Material: Extruded aluminum
- Dimensions (L x W x H): 120 mm x 80 mm x 30 mm
- Weight: Approx. 0.45 kg
- Operating Temperature Range: 0 to 70 deg C
- Thermal Resistance: 0.35 deg C/W (typical)
Applications
- Enterprise data center servers requiring consistent CPU cooling
- High performance computing environments where processor load is sustained
- Virtualization platforms that consolidate multiple workloads on a single blade
- Upgrade or replacement projects for existing DL785 G5/G6 systems
- Any HP ProLiant deployment needing reliable heat dissipation to prevent throttling
This HP Cpu Heatsink provides the essential thermal solution for maintaining peak processor efficiency, reducing downtime, and supporting the rigorous demands of modern server applications.