Name: Bl2x22oc 2nd CPU Heatsink
Brand: HP
Price: 199.95 USD
Availability: InStock

HP 583749-001 Bl2x22oc 2nd CPU Heatsink

The HP part number 583749-001, also known as the Bl2x22oc 2nd CPU Heatsink, is a precision engineered thermal solution designed for high performance HP workstations and servers. This heatsink provides reliable heat dissipation for a second processor ... Read More

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$199.95

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In Stock: 13
Manufacturer: HP
Model or Part: 583749-001
Condition: Refurbished
Weight: 3.00lb

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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview
The HP part number 583749-001, also known as the Bl2x22oc 2nd CPU Heatsink, is a precision engineered thermal solution designed for high performance HP workstations and servers. This heatsink provides reliable heat dissipation for a second processor in dual CPU configurations, helping to maintain optimal operating temperatures and system stability under demanding workloads.

Key Features

Robust aluminum fin array for efficient heat transfer
Integrated mounting brackets compatible with HP chassis specifications
Optimized airflow design that works with standard HP cooling fans
Easy installation with tool-less clip system for quick service
Durable construction that resists corrosion and wear over time

Technical Specifications

Part Number: 583749-001
Manufacturer: HP
Material: Extruded aluminum
Dimensions (L x W x H): 120 mm x 85 mm x 45 mm
Weight: 0.45 kg
Thermal resistance: 0.45 deg C/W (typical)
Maximum operating temperature: 85 deg C
Compatible socket types: HP proprietary dual CPU sockets

Applications
This heatsink is ideal for use in HP Z series workstations, HP ProLiant servers, and other HP platforms that support a second processor. It is suited for engineering, scientific computing, video rendering, and any application where sustained processor performance is critical. By ensuring effective cooling, the Bl2x22oc 2nd CPU Heatsink helps extend component life and reduces the risk of thermal throttling in high load environments.