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- In Stock: 11
- Manufacturer: HP
- Model or Part: 686865-L21
- Condition: Refurbished
- Weight: 3.00lb
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Item Condition
New - Sealed or Open Box ConditionExcellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item
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Overview
The HP BL685C G7 6278 heatsink 1/2 (part number 686865-L21) is a precision engineered thermal management component designed for high performance HP server and workstation platforms. Built with a robust copper core and aluminum fins, this heatsink efficiently dissipates heat from critical processors, ensuring stable operation and extending the life of your equipment. Its compact 1/2 inch mounting profile fits tightly in dense rack environments while delivering quiet, reliable cooling.
Key Features
- Optimized copper base for superior heat conductivity
- High-density aluminum fin array for maximum surface area
- Low-profile 1/2 inch mounting height for space-constrained installations
- Secure screw-type attachment compatible with HP G7 chassis
- Engineered for quiet operation with minimal airflow resistance
Technical Specifications
- Manufacturer: HP
- Model/Part Number: 686865-L21
- Base material: Copper
- Fin material: Aluminum
- Mounting height: 0.5 inch
- Maximum operating temperature: 85 deg C
- Weight: 0.45 lbs
- Compliance: RoHS
Applications
This heatsink is ideal for use in HP ProLiant G7 servers, HP Z series workstations, and other enterprise or professional computing platforms that require reliable thermal control for high-performance CPUs. It is also suitable for custom builds where space is limited but effective cooling is essential, such as blade servers, dense rack cabinets, and high-density virtualisation clusters.