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HP 742657-B21 DL560 G9 CTO Chassis

HP 742657-B21 DL560 G9 CTO Chassis
HP 742657-B21 DL560 G9 CTO Chassis
The HP DL560 G9 CTO Chassis is a high-density, 2U server platform designed for demanding enterprise workloads. Built on the latest Gen9 architecture, this chassis provides flexible configuration options that let you tailor CPU, memory, storage and ne... Read More
price
$859.95
  • In Stock: 6
  • Manufacturer: HP
  • Model or Part: 742657-B21
  • Condition: Refurbished
  • Weight: 3.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview

The HP DL560 G9 CTO Chassis is a high-density, 2U server platform designed for demanding enterprise workloads. Built on the latest Gen9 architecture, this chassis provides flexible configuration options that let you tailor CPU, memory, storage and networking to match your specific needs. Its robust thermal design, hot-swap components and easy serviceability make it ideal for data center environments where uptime and performance are critical.

Key Features

  • 2U rack-mount form factor with front access handles for quick maintenance
  • Supports up to four Intel Xeon Scalable processors for maximum compute power
  • Up to 8 TB of DDR4 memory across 32 DIMM slots for large in-memory workloads
  • Multiple storage options including NVMe, SAS and SATA drives for flexible capacity planning
  • Integrated iLO management with remote console and health monitoring
  • Redundant power supply units (PSU) and cooling fans to ensure continuous operation
  • Scalable networking with optional 10GbE, 25GbE or 100GbE adapters

Technical Specifications

  • Chassis dimensions: 17.2 in (height) x 19.0 in (width) x 8.6 in (depth)
  • Weight: approximately 55 lbs (empty configuration)
  • Processor sockets: 4 x LGA 3647
  • Supported CPUs: Intel Xeon Scalable family, up to 28 cores per socket
  • Memory type: DDR4 ECC Registered or Load Reduced DIMMs
  • Maximum memory capacity: 8 TB (256 GB per DIMM)
  • Storage bays: 8 x hot-swap drive bays supporting 2.5 in or 3.5 in form factors
  • Expansion slots: up to 7 PCIe Gen4 slots, including full height and low profile options
  • Power supply: Redundant 800W or 1200W hot-plug PSUs (configurable)
  • Operating temperature range: 10 degrees C to 35 degrees C (50 degrees F to 95 degrees F)
  • Compliance: RoHS, ENERGY STAR and FCC Part 15

Applications

  • Virtualization hosts running VMware, Hyper-V or KVM clusters
  • High performance computing (HPC) workloads that require dense CPU core counts
  • Database servers for Oracle, Microsoft SQL Server and PostgreSQL environments
  • Enterprise resource planning (ERP) and customer relationship management (CRM) platforms
  • Big data analytics and in-memory processing with large RAM footprints
  • Cloud infrastructure services that demand rapid scaling and reliable uptime

This HP DL560 G9 CTO Chassis delivers the performance, scalability and manageability needed to power modern data center workloads while providing a foundation for future growth.