Name: Bl460c Gen9 Front Heat Sink
Brand: HP
Price: 24.95 USD
Availability: InStock

HP 777688-001 Bl460c Gen9 Front Heat Sink

The HP Bl460c Gen9 Front Heat Sink (part number 777688-001) is a precision engineered cooling component designed for the HP BladeSystem c460c Gen9 enclosure. It provides efficient thermal management for the front-mounted processors and memory modules... Read More

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$24.95

In Stock: 89
Manufacturer: HP
Model or Part: 777688-001
Condition: Refurbished
Weight: 0.80lb

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Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview
The HP Bl460c Gen9 Front Heat Sink (part number 777688-001) is a precision engineered cooling component designed for the HP BladeSystem c460c Gen9 enclosure. It provides efficient thermal management for the front-mounted processors and memory modules, helping to maintain optimal performance and reliability in high density data center environments. Constructed from high conductivity aluminum and featuring a low profile design, this heat sink fits seamlessly into the blade chassis without requiring additional modifications.

Key Features

Optimized fin layout for maximum airflow and heat dissipation
Lightweight aluminum construction reduces overall system weight
Direct fit for HP Bl460c Gen9 chassis - no drilling or trimming required
Easy installation with standard mounting hardware included
Compatible with a range of Intel Xeon processor families used in the Gen9 platform

Technical Specifications

Part Number: 777688-001
Material: Extruded aluminum
Dimensions (L x W x H): 250 mm x 150 mm x 30 mm
Weight: Approx 0.9 kg
Operating temperature range: 0 to 55 deg C
Designed for airflow rates up to 120 CFM

Applications
Ideal for use in HP BladeSystem c460c Gen9 servers deployed in virtualized workloads, cloud computing, and enterprise database environments. The front heat sink is especially beneficial in rack configurations where front-to-back airflow is critical, such as high performance computing clusters, financial trading platforms, and large scale web hosting facilities. By ensuring consistent processor temperatures, it helps extend component life and maintain system uptime.