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- In Stock: 3
- Manufacturer: HP
- Model or Part: 780967-001
- Condition: Refurbished
- Weight: 12.00lb
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Item Condition
New - Sealed or Open Box ConditionExcellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item
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Overview
The HP Ml350 G9 V3 System Board (part number 780967-001) is a high-performance motherboard designed for the HP ProLiant Ml350 Gen9 server platform. Engineered to deliver reliable processing power, this board supports the latest Intel Xeon E5 v4 processors and provides robust connectivity for demanding data center workloads. It replaces aging legacy boards with a modern architecture that enhances system stability, scalability, and energy efficiency.
Key Features
- Support for dual socket Intel Xeon E5 v4 CPUs up to 22 cores per processor
- Integrated LGA2011-3 socket layout for easy CPU installation
- Advanced chipset with PCIe 3.0 support for high bandwidth expansion cards
- Onboard management controller with iLO 4 remote console capabilities
- Enhanced memory channels supporting up to 768 GB DDR4 RAM
- Multiple SATA and SAS ports for flexible storage configurations
- Built-in security features including TPM 2.0 support
Technical Specifications
- Form factor: Standard ATX server board
- Chipset: Intel C612
- CPU sockets: 2 x LGA2011-3
- Memory slots: 24 DIMM slots, DDR4 ECC registered
- Maximum memory: 768 GB
- PCIe slots: 7 x PCIe 3.0 (various lane configurations)
- SATA ports: 8 x SATA III (6 Gbps)
- SAS ports: 2 x SAS 12 Gb/s connectors
- Network interfaces: Integrated dual Gigabit Ethernet
- Power supply requirement: 500 W to 800 W redundant PSU support
- Operating temperature: 0 to 35 degrees Celsius (non-redundant) or 10 to 40 degrees Celsius (redundant)
Applications
This system board is ideal for virtualization hosts, database servers, high-performance computing clusters, and enterprise resource planning environments. Its scalability makes it suitable for growing workloads in financial services, healthcare analytics, and cloud infrastructure deployments.