Name: Hot Plug Fan Assembly Module
Brand: HP
Price: 59.95 USD
Availability: InStock

HP 780976-001 Hot Plug Fan Assembly Module

The HP Hot Plug Fan Assembly Module (part number 780976-001) is a high performance cooling solution designed for seamless integration into servers and storage systems that support hot plug operation. This fan module delivers reliable airflow to criti... Read More

price

$59.95

In Stock: 1
Manufacturer: HP
Model or Part: 780976-001
Condition: Refurbished
Weight: 2.00lb

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Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview
The HP Hot Plug Fan Assembly Module (part number 780976-001) is a high performance cooling solution designed for seamless integration into servers and storage systems that support hot plug operation. This fan module delivers reliable airflow to critical components while allowing maintenance or replacement without shutting down the host equipment, minimizing downtime and keeping your data center running efficiently.

Key Features

Hot plug capability for serviceable cooling without power loss
High static pressure design optimised for dense hardware configurations
Durable bearing system that reduces noise and extends service life
Standard 120mm form factor compatible with most HP server chassis
Integrated speed control interface for dynamic thermal management

Technical Specifications

Model / Part Number: 780976-001
Dimensions (L x W x H): 120 mm x 120 mm x 38 mm
Airflow: 55 CFM (cubic feet per minute) at maximum speed
Noise level: 32 dBA measured at 7 inches
Operating voltage: 12 V DC
Speed range: 2000 - 3500 RPM
Connector type: Standard 4-pin PWM fan connector
Operating temperature: 0 to 50 degrees Celsius
Certification: RoHS compliant

Applications
The HP Hot Plug Fan Assembly Module is ideal for use in enterprise servers, blade enclosures, high density storage arrays and networking equipment that require continuous cooling while supporting hot swap maintenance. It is particularly suited for data centers, cloud computing platforms and any mission critical environment where uptime and thermal reliability are paramount.