Name: Dl360 G10 Heatsink
Brand: HP
Price: 39.95 USD
Availability: InStock

HP 873589-001 Dl360 G10 Heatsink

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$39.95

In Stock: 9
Manufacturer: HP
Model or Part: 873589-001
Condition: Refurbished
Weight: 3.00lb

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Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview

The HP Dl360 G10 Heatsink (part number 873589-001) is a precision engineered cooling component designed for the HP ProLiant DL360 Gen10 server platform. Built to maintain optimal processor temperatures, this heatsink ensures reliable performance under heavy workloads and extends the life of critical CPU components. Its compact form factor fits seamlessly into the dense rackmount chassis, delivering efficient heat dissipation without compromising system airflow.

Key Features

High thermal conductivity aluminum base for rapid heat transfer
Optimized fin geometry to maximize surface area and airflow efficiency
Secure mounting brackets compatible with standard DL360 Gen10 chassis
Lightweight design reduces overall system weight while maintaining durability
Easy installation with tool-less clip mechanism

Technical Specifications

Part Number: 873589-001
Manufacturer: HP
Material: Anodized aluminum
Dimensions (L x W x H): 120 mm x 95 mm x 30 mm
Weight: approx 0.45 kg
Operating Temperature Range: 0 deg C to 85 deg C
Fin Count: 36 high-efficiency fins
Compatibility: HP ProLiant DL360 Gen10 servers with Intel Xeon Scalable processors

Applications

Data center rack servers requiring reliable thermal management
High performance computing (HPC) clusters where sustained CPU load is common
Virtualization environments that run multiple VMs on a single host
Enterprise workloads such as database, analytics and cloud services
Any HP DL360 Gen10 deployment needing replacement or upgrade of the original heatsink

This HP Dl360 G10 Heatsink provides the cooling performance needed to keep your server running at peak efficiency, reducing thermal throttling risk and supporting uninterrupted operation in demanding IT environments.