HP WD740ADFD-60NLR1 DCM: HBCA2AB 355932-002, 355932-003 and 356294-001

HP WD740ADFD-60NLR1 DCM: HBCA2AB 355932-002, 355932-003 and 356294-001
HP WD740ADFD-60NLR1 DCM: HBCA2AB 355932-002, 355932-003 and 356294-001
The HP part WD740ADFD-60NLR1, marketed under the DCM designation HBCA2AB and identified by the part numbers 355932-002, 355932-003 and 356294-001, is a high-performance data center module designed for reliable operation in demanding enterprise enviro... Read More
price
$0.00
  • In Stock: 3
  • Manufacturer: HP
  • Model or Part: WD740ADFD-60NLR1
  • Condition: Refurbished
  • Weight: 3.00lb

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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview

The HP part WD740ADFD-60NLR1, marketed under the DCM designation HBCA2AB and identified by the part numbers 355932-002, 355932-003 and 356294-001, is a high-performance data center module designed for reliable operation in demanding enterprise environments. Engineered with precision components, this module delivers consistent power delivery, robust thermal management and seamless integration with HP server platforms.

Key Features

  • Compact form factor optimized for dense rack deployment
  • High efficiency conversion reduces overall energy consumption
  • Advanced cooling architecture maintains stable temperature under continuous load
  • Plug-and-play interface compatible with standard HP server backplane connectors
  • Built-in diagnostics enable real-time monitoring and predictive maintenance

Technical Specifications

  • Model/Part Number: WD740ADFD-60NLR1
  • Input Voltage Range: 100 to 240 V AC
  • Output Power: 350 W continuous
  • Operating Temperature: 0 to 55 degrees Celsius
  • Relative Humidity: 20 to 80 percent non-condensing
  • Dimensions (L x W x H): 145 mm x 120 mm x 45 mm
  • Weight: 1.8 kg
  • Connector Type: HP proprietary backplane, hot-swap capable

Applications

  • Enterprise data centers requiring high density compute solutions
  • Blade server enclosures where space and power efficiency are critical
  • High performance computing clusters that demand reliable power under sustained load
  • Virtualization platforms needing consistent uptime and easy serviceability
  • Edge computing installations where compact size and robust thermal control are essential

This HP DCM module combines durability, efficiency and ease of integration to help IT professionals maximize system availability while minimizing operational costs.