IBM 00FK456 Heatsink Low-t Case X350 M5

IBM 00FK456 Heatsink Low-t Case X350 M5
IBM 00FK456 Heatsink Low-t Case X350 M5
The IBM Heatsink Low-t Case X350 M5 (part number 00FK456) is a high-performance thermal management solution designed for compact server and workstation chassis. Engineered with precision CNC machining, this low-profile heatsink delivers efficient hea... Read More
price
$56.95

Ships next business day.

  • In Stock: 2
  • Manufacturer: IBM
  • Model or Part: 00FK456
  • Condition: Refurbished
  • Weight: 3.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview

The IBM Heatsink Low-t Case X350 M5 (part number 00FK456) is a high-performance thermal management solution designed for compact server and workstation chassis. Engineered with precision CNC machining, this low-profile heatsink delivers efficient heat dissipation while fitting into space-constrained environments. Its robust construction and optimized fin design keep critical components cool under heavy workloads, extending system reliability and performance.

Key Features

  • Low-height profile for tight enclosure installations
  • Aluminum alloy base with copper heat pipes for rapid thermal transfer
  • High density fin array maximizes surface area without increasing bulk
  • Integrated mounting brackets compatible with standard IBM X350 chassis
  • Easy installation with tool-free snap clips and pre-drilled holes
  • Durable finish resistant to corrosion and wear

Technical Specifications

  • Model/Part Number: 00FK456
  • Base material: Aluminum alloy
  • Heat pipe material: Copper
  • Fin material: Aluminum
  • Overall dimensions (L x W x H): 150 mm x 120 mm x 25 mm
  • Weight: 0.45 kg
  • Maximum operating temperature: 85 deg C
  • Thermal resistance: 0.35 deg C/W
  • Compatibility: IBM X350 series low-t cases, standard M5 mounting pattern

Applications

This heatsink is ideal for use in high-density data center servers, blade systems, and enterprise workstations where space is at a premium. It provides reliable cooling for CPUs, ASICs, and other heat-generating components in environments that demand continuous operation and minimal thermal throttling.