IBM 74Y2022 Non-RAID Backplane Interposer Card Assembly for Power 8231

IBM 74Y2022 Non-RAID Backplane Interposer Card Assembly for Power 8231
IBM 74Y2022 Non-RAID Backplane Interposer Card Assembly for Power 8231
The IBM 74Y2022 Non-RAID Backplane Interposer Card Assembly is engineered specifically for the Power 8231 server platform. This high-density interposer provides reliable, low-latency connectivity between the backplane and attached storage devices wit... Read More
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  • In Stock: 24
  • Manufacturer: IBM
  • Model or Part: 74Y2022
  • Condition: Refurbished
  • Weight: 3.00lb

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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview

The IBM 74Y2022 Non-RAID Backplane Interposer Card Assembly is engineered specifically for the Power 8231 server platform. This high-density interposer provides reliable, low-latency connectivity between the backplane and attached storage devices without the complexity of RAID controllers. Designed to meet the rigorous standards of enterprise data centers, it delivers consistent performance in demanding workloads while simplifying system architecture.

Key Features

  • Optimized for IBM Power 8231 chassis with direct plug-in design
  • Non-RAID configuration for streamlined signal paths and reduced overhead
  • High pin count ensures robust data integrity across all channels
  • Gold plated contacts for superior conductivity and corrosion resistance
  • Compact form factor fits within standard server rack dimensions
  • Thermal design supports operation up to 55 deg C ambient temperature

Technical Specifications

  • Part Number: 74Y2022
  • Manufacturer: IBM
  • Connector Type: High-speed mezzanine edge connector
  • Number of Data Lanes: 32
  • Supported Interface: PCIe Gen3 x4 per lane
  • Power Consumption: Max 8 W
  • Operating Temperature Range: 0 deg C to 55 deg C
  • Storage Compatibility: SATA III, SAS 12Gb/s drives (non-RAID mode)
  • Dimensions: 150 mm x 120 mm x 5 mm (L x W x H)
  • Compliance: RoHS, IEC 60950

Applications

  • Enterprise server deployments requiring reliable direct-attach storage
  • High performance computing clusters where low latency is critical
  • Virtualization environments that benefit from simplified storage paths
  • Data analytics platforms handling large data sets with fast I/O demands
  • Backup and archival systems using non-RAID disk arrays for cost effective capacity expansion

This interposer card assembly offers a balance of performance, durability, and ease of integration, making it an ideal choice for organizations looking to maximize the capabilities of their IBM Power 8231 infrastructure.