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- In Stock: 17
- Manufacturer: IBM
- Model or Part: 7865-91XX
- Condition: Refurbished
- Weight: 3.00lb
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Item Condition
New - Sealed or Open Box ConditionExcellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item
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Overview
The IBM System Proc Cec Backplane (part number 7865-91XX) is a high-performance interconnect solution designed for IBM Power Systems and blade server environments. Engineered to provide reliable, low-latency communication between processor modules, I/O cards and storage devices, this backplane enables dense system configurations while maintaining excellent signal integrity.
Key Features
- Robust 64-bit data path supporting up to 32 Gbps per lane
- Modular design for easy installation and serviceability
- Optimized trace geometry reduces crosstalk and electromagnetic interference
- Supports hot-swap operation for minimal downtime
- Compatible with IBM System x, BladeCenter and Power Systems chassis
Technical Specifications
- Model/Part Number: 7865-91XX
- Form factor: Standard backplane size for IBM blade enclosures
- Connector type: High-density high-speed mezzanine connectors
- Signal bandwidth: Up to 32 Gbps per channel
- Power rating: Supports up to 250 watts per slot
- Operating temperature range: 0 deg to 55 deg C (ambient)
- Compliance: RoHS, IEC 60950 and FCC Class B
Applications
This backplane is ideal for data center deployments that require scalable compute power and fast inter-module communication. Typical uses include:
- High-performance computing clusters
- Virtualization hosts with multiple I/O intensive workloads
- Enterprise storage arrays requiring low latency access
- Mission critical server blades in financial services, healthcare and research institutions
By integrating the IBM System Proc Cec Backplane into your infrastructure, you gain a reliable backbone that supports future growth while delivering consistent performance across demanding workloads.