IBM 90P5281 Heat Sink X336

IBM 90P5281 Heat Sink X336
IBM 90P5281 Heat Sink X336
The IBM Heat Sink X336 (part number 90P5281) is a high performance thermal management solution designed for demanding server and data center environments. Engineered with precision aluminum fins and an optimized copper base, the X336 efficiently diss... Read More
price
$18.95
  • In Stock: 21
  • Manufacturer: IBM
  • Model or Part: 90P5281
  • Condition: Refurbished
  • Weight: 3.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview

The IBM Heat Sink X336 (part number 90P5281) is a high performance thermal management solution designed for demanding server and data center environments. Engineered with precision aluminum fins and an optimized copper base, the X336 efficiently dissipates heat from CPUs, GPUs, ASICs and other high power components, helping maintain stable operation and prolonging component life.

Key Features

  • High surface area fin design for maximum airflow interaction
  • Copper base with low thermal resistance for rapid heat transfer
  • Integrated mounting brackets compatible with standard IBM server chassis
  • Lightweight construction reduces overall system weight without sacrificing strength
  • Easy installation with tool-less snap fit clips

Technical Specifications

  • Part number: 90P5281
  • Dimensions (L x W x H): 120 mm x 100 mm x 30 mm
  • Base material: Copper
  • Fin material: Aluminum alloy 6063
  • Maximum operating temperature: 125 deg C
  • Thermal resistance: 0.35 deg C/W
  • Weight: 350 g
  • Compatible fan size: 120 mm x 120 mm x 25 mm

Typical Applications

  • Enterprise servers and blade systems
  • High performance computing clusters
  • Data center networking equipment
  • Industrial control units with high power processors
  • Custom rack mount workstations requiring reliable cooling

Choose the IBM Heat Sink X336 to ensure your critical hardware stays cool under load, improve system reliability and reduce downtime.