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- In Stock: 2
- Manufacturer: Oracle
- Model or Part: 310-0206
- Condition: Refurbished
- Weight: 3.00lb
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Item Condition
New - Sealed or Open Box ConditionExcellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item
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Overview
The Oracle 310-0206 Heatsink Assembly for X2250 is a precision engineered cooling solution designed to maintain optimal thermal performance of the X2250 server processor. Constructed from high conductivity aluminum alloy and featuring an advanced fin layout, this heatsink dissipates heat efficiently under demanding data center workloads. Its compact form factor fits seamlessly into standard rack mount servers, providing reliable operation while extending component lifespan.
Key Features
- High thermal conductivity material for rapid heat transfer
- Optimized fin geometry that maximizes surface area without increasing volume
- Secure mounting brackets compatible with standard X2250 socket
- Integrated dust guard to reduce maintenance intervals
- Lightweight design reduces overall system weight
Technical Specifications
- Part Number: 310-0206
- Manufacturer: Oracle
- Material: Aluminum alloy (6063 grade)
- Dimensions (L x W x H): 95 mm x 85 mm x 30 mm
- Maximum operating temperature: 85 deg C
- Thermal resistance: 0.35 deg C/W
- Weight: 120 grams
- Compatibility: X2250 server processor socket
Applications
- Enterprise data center servers using the Oracle X2250 platform
- High performance computing clusters requiring stable thermal management
- Virtualization hosts that run multiple workloads on a single CPU
- Mission critical applications where uptime and reliability are paramount
- Upgrade or replacement projects for existing X2250 systems
This heatsink assembly delivers consistent cooling performance, helping to prevent thermal throttling and ensuring your server operates at peak efficiency. Choose the Oracle 310-0206 for a dependable, easy-install solution that protects valuable hardware investment.