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- In Stock: 5
- Manufacturer: Oracle
- Model or Part: 310-0303
- Condition: Refurbished
- Weight: 3.00lb
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Item Condition
New - Sealed or Open Box ConditionExcellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item
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Overview
The Oracle 310-0303 Heatsink Assembly for T3-1 is a precision engineered thermal management component designed to keep high performance processors operating within optimal temperature ranges. This robust heatsink provides efficient heat dissipation, reliable mounting, and long term durability for demanding data center and enterprise environments.
Key Features
- Optimized fin geometry for maximum airflow and heat transfer
- Aluminum base with copper heat pipes for rapid thermal conduction
- Secure locking mechanism compatible with standard T3-1 chassis
- Lightweight design reduces overall system weight without sacrificing strength
- Easy installation with pre drilled mounting holes and alignment tabs
Technical Specifications
- Part Number: 310-0303
- Material: Aluminum base, copper heat pipes
- Dimensions (L x W x H): 120 mm x 100 mm x 35 mm
- Thermal resistance: less than 0.5 deg C per watt
- Maximum operating temperature: up to 85 degrees Celsius
- Weight: approx 1.2 kg
- Compatible with Oracle T3-1 server models only
Applications
- Enterprise servers that require reliable cooling for high density CPU workloads
- Data center racks where space and airflow efficiency are critical
- Virtualization platforms running multiple virtual machines per node
- High performance computing clusters that demand consistent thermal performance
- Upgrade or replacement projects for existing T3-1 systems seeking improved heat management
By choosing the Oracle 310-0303 Heatsink Assembly, customers benefit from reduced thermal throttling, extended processor lifespan, and lower overall system energy consumption. This component is an essential part of any robust server cooling strategy.