Oracle 7026486 Heatsink Assembly

Oracle 7026486 Heatsink Assembly
Oracle 7026486 Heatsink Assembly
The Oracle 7026486 Heatsink Assembly is a precision engineered thermal management component designed to keep high performance processors and power modules operating within safe temperature limits. Constructed from extruded aluminum with a finely mach... Read More
price
$94.95

Ships next business day.

  • In Stock: 14
  • Manufacturer: Oracle
  • Model or Part: 7026486
  • Condition: Refurbished
  • Weight: 3.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview

The Oracle 7026486 Heatsink Assembly is a precision engineered thermal management component designed to keep high performance processors and power modules operating within safe temperature limits. Constructed from extruded aluminum with a finely machined fin array, this heatsink delivers efficient heat dissipation while maintaining a low profile that fits tightly into standard server and workstation chassis.

Key Features

  • Optimized fin geometry for maximum airflow and heat transfer
  • Lightweight aluminum construction reduces overall system weight
  • Integrated mounting brackets simplify installation on compatible motherboards
  • Surface treated with anodized coating to resist corrosion and wear
  • Compatible with standard fan modules for active cooling solutions

Technical Specifications

  • Part Number: 7026486
  • Material: Extruded aluminum with anodized finish
  • Dimensions (L x W x H): 120 mm x 100 mm x 45 mm
  • Fin density: 30 fins per inch
  • Maximum operating temperature: 85 deg C
  • Weight: 0.35 kg
  • Mounting hole pattern: 4 x M3 screws, 50 mm spacing

Applications

  • Enterprise servers that require reliable thermal control for multi-core CPUs
  • High performance workstations used in data analysis and graphics rendering
  • Network equipment racks where space is limited but cooling efficiency is critical
  • Industrial computing platforms operating in harsh environments
  • Custom built blade systems that demand low profile yet effective heat dissipation

This heatsink assembly from Oracle provides a proven solution for maintaining optimal performance and longevity of your most demanding hardware. Its easy installation, robust construction, and superior thermal characteristics make it an ideal upgrade or replacement part for any compatible system.