Name: Processor Module Filler Panel
Brand: Oracle
Price: 106.95 USD
Availability: InStock

Oracle 7048661 Processor Module Filler Panel

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$106.95

Ships next business day.

In Stock: 3
Manufacturer: Oracle
Model or Part: 7048661
Condition: Refurbished
Weight: 3.00lb

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Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview

The Oracle Processor Module Filler Panel (Model 7048661) is a precision engineered component designed to fill empty slots in server chassis when processor modules are not installed. By occupying unused spaces, the filler panel helps maintain optimal airflow, reduces dust accumulation, and preserves the structural integrity of the rack or tower system. This essential accessory ensures that your Oracle servers continue to operate efficiently even during phased upgrades or partial deployments.

Key Features

Exact fit for Oracle server chassis supporting processor modules
High quality polymer construction for durability and low weight
Tool-less installation with snap-fit design for quick deployment
Provides consistent airflow management to prevent hot spots
Neutral grey finish that blends with standard server interiors

Technical Specifications

Manufacturer: Oracle
Model/Part Number: 7048661
Dimensions (L x W x H): 120 mm x 30 mm x 15 mm (approx.)
Material: Reinforced polymer with fire-retardant properties
Weight: 45 grams (approx.)
Operating Temperature Range: 0 to 55 degrees Celsius
Compliance: RoHS, IEC 60950-1

Applications

Data center rack servers where some processor slots are unused
Enterprise environments planning staged hardware upgrades
Testing labs that require consistent server configuration without active CPUs
Remote or edge deployments where environmental control is critical
Any Oracle server platform that uses the standard processor module form factor

This filler panel offers a simple, cost-effective solution to protect your hardware investment while supporting optimal thermal performance and system reliability.