Oracle 7049988 Processor Module Filler Panel

Oracle 7049988 Processor Module Filler Panel
Oracle 7049988 Processor Module Filler Panel
The Oracle Processor Module Filler Panel (part number 7049988) is a precision engineered component designed to occupy empty slots in server chassis when a processor module is not installed. By providing a secure, airflow-balanced filler, it helps mai... Read More
price
$149.95

Ships next business day.

  • In Stock: 4
  • Manufacturer: Oracle
  • Model or Part: 7049988
  • Condition: Refurbished
  • Weight: 3.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview

The Oracle Processor Module Filler Panel (part number 7049988) is a precision engineered component designed to occupy empty slots in server chassis when a processor module is not installed. By providing a secure, airflow-balanced filler, it helps maintain optimal cooling performance and protects internal connectors from dust and accidental damage. This panel integrates seamlessly with Oracle rack and blade servers, ensuring that system integrity and thermal efficiency are preserved even during phased upgrades or maintenance cycles.

Key Features

  • Custom-fit design for Oracle server models supporting the 7049988 part number
  • High-quality metal construction for durability and EMI shielding
  • Tool-free installation with snap-in latches for rapid deployment
  • Optimized airflow channels to prevent hot spots in partially populated chassis
  • Dust-resistant sealed front surface to protect internal components
  • Lightweight yet robust, reducing overall system weight without compromising strength

Technical Specifications

  • Part Number: 7049988
  • Manufacturer: Oracle
  • Material: Anodized aluminum alloy
  • Dimensions (L x W x H): 300 mm x 30 mm x 10 mm (approx.)
  • Weight: 0.4 kg
  • Operating temperature range: -20 to 85 degrees C
  • Compliance: RoHS, REACH
  • Connector type: Standard processor slot filler interface

Applications

  • Enterprise data centers where server density varies over time
  • Blade and rack servers undergoing phased CPU upgrades
  • Maintenance scenarios that require empty slots to remain sealed
  • High-performance computing clusters needing consistent cooling across all bays
  • Any Oracle hardware environment seeking to protect unused processor sockets while preserving thermal balance

By installing the Oracle Processor Module Filler Panel, administrators can safeguard valuable hardware investments, extend equipment life, and maintain predictable performance even when server configurations change.