Name: Heatsink R530
Brand: Dell
Price: 52.95 USD
Availability: InStock

Dell 08XH97 Heatsink R530

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$52.95

Ships next business day.

In Stock: 6
Manufacturer: Dell
Model or Part: 08XH97
Condition: Refurbished
Weight: 3.00lb

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Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview

The Dell Heatsink R530 (part number 08XH97) is a precision engineered cooling component designed to maintain optimal operating temperatures for high-performance server processors. Built with advanced aluminum extrusion and integrated heat pipe technology, this heatsink delivers reliable thermal management in demanding data center environments. Its low profile design fits seamlessly into the Dell PowerEdge R530 chassis, ensuring efficient airflow while minimizing space usage.

Key Features

High conductivity aluminum base for rapid heat transfer
Integrated copper heat pipes that spread heat evenly across the fins
Optimized fin geometry to maximize airflow from server fans
Secure mounting system compatible with Dell R530 processor sockets
Durable construction resistant to vibration and shock
Easy installation with tool-free clips for quick serviceability

Technical Specifications

Base material: CNC machined aluminum alloy
Heat pipe material: Copper, 6 pipes
Fin count: 48 thin fins
Dimensions (L x W x H): 85 mm x 65 mm x 30 mm
Weight: Approx. 150 g
Operating temperature range: 0 to 85 degrees Celsius
Compatibility: Dell PowerEdge R530, Intel Xeon E5-2600 v3/v4 series processors

Applications

Enterprise servers requiring consistent thermal performance
Virtualization hosts running multiple workloads simultaneously
High density blade and rack installations where space is limited
Data center environments with strict uptime requirements
Upgrade projects for older R530 systems seeking improved cooling efficiency

This Dell Heatsink R530 provides the reliability and performance needed to keep critical server workloads running smoothly, reducing thermal throttling risk and extending component lifespan.