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- In Stock: 1
- Manufacturer: Dell
- Model or Part: X3PGJ
- Condition: New
- Weight: 3.00lb
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Overview
The Dell PowerEdge Midplane Circuit Board (Model X3PGJ) is a high-performance interconnect solution designed for Dell PowerEdge rack servers and blade systems. Engineered to provide reliable signal routing between system boards, power supplies, and peripheral modules, this midplane board enables seamless data flow and robust power distribution in demanding enterprise environments.
Key Features
- Optimized trace layout for low latency communication
- High density connector array supports multiple I/O standards
- Enhanced thermal design with built-in heat dissipation pathways
- Compatible with a wide range of Dell PowerEdge models and configurations
- Rigid, multilayer construction for superior mechanical stability
- Easy installation with standard rack mounting hardware
Technical Specifications
- Part Number: X3PGJ
- Form Factor: Midplane (standard 19 inch rack width)
- Layer Count: 8 layers
- Connector Type: High-density edge connectors, 48 pins per side
- Signal Integrity: Impedance controlled at 50 ohms
- Operating Temperature Range: 0 deg to 55 deg Celsius
- Power Rating: Supports up to 1200 watts total system draw
- Material: FR4 substrate with copper plating
Applications
- Enterprise data center servers requiring high bandwidth interconnects
- Virtualisation hosts that demand low latency and reliable power delivery
- High performance computing (HPC) clusters where signal integrity is critical
- Blade enclosure backplanes for modular server deployments
- Mission-critical workloads such as database servers, email gateways and virtualization platforms
This Dell PowerEdge Midplane Circuit Board delivers the durability, performance and flexibility needed to keep your server infrastructure running at peak efficiency. Whether you are upgrading an existing rack or building a new data center, X3PGJ provides the foundation for reliable operation and future expansion.