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HP 403323-B23 BladeSystem c7000 CTO Blade Server Enclosure

HP 403323-B23 BladeSystem c7000 CTO Blade Server Enclosure
HP 403323-B23 BladeSystem c7000 CTO Blade Server Enclosure
The HP BladeSystem c7000 CTO Blade Server Enclosure (part number 403323-B23) is a high-density, modular chassis designed to host multiple blade servers, storage modules and networking components in a single, space-efficient platform. Built for enterp... Read More
price
$1,279.95
  • In Stock: 9
  • Manufacturer: HP
  • Model or Part: 403323-B23
  • Condition: Refurbished
  • Weight: 3.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview
The HP BladeSystem c7000 CTO Blade Server Enclosure (part number 403323-B23) is a high-density, modular chassis designed to host multiple blade servers, storage modules and networking components in a single, space-efficient platform. Built for enterprise data centers and cloud environments, the enclosure delivers scalable compute power, streamlined cabling and simplified management, helping IT teams reduce footprint while increasing performance and reliability.

Key Features

  • Supports up to 16 half-height or 8 full-height blades in a single chassis
  • Integrated midplane provides high-speed, low-latency interconnects for all installed modules
  • Hot-plug blade and power module capability minimizes downtime during upgrades or maintenance
  • Advanced thermal management with intelligent fan control for optimal cooling and energy efficiency
  • Embedded iLO management engine enables remote monitoring, provisioning and troubleshooting
  • Flexible I/O options include multiple 10GbE, 40GbE and Fibre Channel adapters
  • Redundant power supplies and cooling fans ensure continuous operation in mission-critical environments

Technical Specifications

  • Chassis dimensions: 22.2 in (W) x 31.5 in (H) x 30.0 in (D)
  • Weight (empty): approx 150 lb
  • Power: Dual redundant hot-swap power supplies, up to 1600 W each
  • Cooling: Variable speed fans with automatic temperature monitoring
  • Management: HP iLO Advanced with secure remote console access
  • Supported blade formats: HP ProLiant BL, DL and SL series
  • Expansion: Up to 8 I/O modules, 4 management modules, and 2 storage modules
  • Operating temperature: 0 to 40 degrees Celsius (32 to 104 degrees Fahrenheit)
  • Compliance: RoHS, ENERGY STAR and EPEAT Gold certified

Typical Applications

  • Virtualization clusters that require dense compute resources with low power consumption
  • High-performance computing (HPC) workloads where fast inter-blade communication is critical
  • Private cloud deployments needing scalable, modular infrastructure
  • Enterprise database and analytics platforms that benefit from redundant power and cooling
  • Converged infrastructure solutions that combine compute, storage and networking in a single enclosure