Name: AMD 6278 Heatsink 3/4
Brand: HP
Price: 318.95 USD
Availability: InStock

HP 686865-B21 AMD 6278 Heatsink 3/4

The HP part number 686865-B21 is a precision engineered AMD 6278 heatsink designed for 3/4 inch mounting configurations. This high performance cooling solution is built to manage the thermal output of AMD EPYC 6278 processors in demanding server and ... Read More

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$318.95

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In Stock: 11
Manufacturer: HP
Model or Part: 686865-B21
Condition: Refurbished
Weight: 3.00lb

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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview
The HP part number 686865-B21 is a precision engineered AMD 6278 heatsink designed for 3/4 inch mounting configurations. This high performance cooling solution is built to manage the thermal output of AMD EPYC 6278 processors in demanding server and workstation environments. Its robust construction and optimized fin layout provide consistent temperature control, helping to maintain system stability and extend component lifespan.

Key Features

Directly compatible with AMD EPYC 6278 processor package
3/4 inch mounting hole pattern for easy installation in standard chassis
Aluminum fin array with high surface area for efficient heat dissipation
Integrated heat pipe design to transfer heat quickly from the CPU die
Low profile form factor that fits dense server racks and blade enclosures
Pre-finished surface for reduced thermal resistance and easy cleaning

Technical Specifications

Model / Part Number: 686865-B21
Manufacturer: HP
Supported Processor: AMD EPYC 6278
Mounting Size: 3/4 inch (19.05 mm) hole spacing
Material: Anodized aluminum fins with copper heat pipes
Maximum Operating Temperature: 85 deg C
Weight: Approx 0.9 lbs (0.4 kg)
Dimensions (L x W x H): 120 mm x 95 mm x 30 mm

Applications
This heatsink is ideal for use in high-density data center servers, enterprise blade systems, and professional workstations that require reliable cooling for AMD EPYC 6278 CPUs. It is also suitable for custom build servers, virtualization platforms, and any environment where sustained processing loads generate significant heat. By delivering efficient thermal management, the HP AMD 6278 heatsink helps maintain optimal performance and reduces the risk of thermal throttling in mission critical applications.