Name: Midplane for 1747-hc2
Brand: IBM
Price: 78.95 USD
Availability: InStock

IBM 00E6034 Midplane for 1747-hc2

price

$78.95

In Stock: 9
Manufacturer: IBM
Model or Part: 00E6034
Condition: Refurbished
Weight: 3.00lb

Qty

Add to Cart

Buy Now

Add to Wish List

Shipping Information

United States Shipping

Orders over $200 qualify for Free Super-Saver Shipping! We ship at our discretion via the most cost-effective method using FedEx, UPS, or USPS.

To ensure your order is processed efficiently, all shipping charges must be pre-paid at checkout. We are unable to bill directly to third-party shipper accounts or use customer-provided labels for domestic shipments.

International Shipping

International orders begin processing as soon as payment is confirmed.

Pre-paid Shipping: For your convenience, you can select and pay for international shipping directly at checkout.
Carrier Accounts: Alternatively, we can bill transport costs directly to your FedEx account number. (Note: We cannot bill to DHL, TNT, or UPS accounts).
Customer Labels: We are also happy to ship internationally using pre-paid labels provided by you for any carrier.

Expedited and Rush Shipping

Need it faster? HardwareJet.com offers 1 or 2-day expedited shipping options during checkout for eligible items.

To get your order to the front of the line, expedited orders include a small rush fee in addition to the carrier's shipping charges. If an item is not available for expedited shipping, these options will not appear in your cart.

Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

To bring you an even wider selection, some of our items are shipped directly from our trusted partners. Delivery times may vary for these items.

💬 Recently Purchased by Your Peers

Description

Overview

The IBM 00E6034 Midplane for the 1747-hc2 is a high-density interconnect module that provides reliable signal routing and power distribution within the IBM 1747 series chassis. Designed with precision printed circuit technology, this midplane enables seamless communication between multiple line cards while maintaining optimal performance in demanding data processing environments.

Key Features

Robust copper alloy construction for long term durability
Optimized trace layout to reduce signal loss and crosstalk
Supports hot-swap line cards for minimal system downtime
Compact form factor that fits the standard 1747-hc2 chassis dimensions
Enhanced thermal management through integrated heat spreaders

Technical Specifications

Model/Part Number: 00E6034
Compatible Chassis: IBM 1747-hc2
Connector Type: High-speed backplane connectors, 48 pins per side
Signal Capacity: Up to 128 high-speed channels
Power Rating: 250 watts total across all slots
Operating Temperature Range: 0 deg C to 55 deg C
Material: FR-4 substrate with copper alloy plating
Dimensions: Fits standard 1747-hc2 midplane slot (exact measurements per IBM documentation)

Applications

Mainframe and server backplane integration for IBM System z platforms
High-performance computing clusters requiring reliable inter-module connectivity
Enterprise data center environments that demand hot-swap capability and low latency communication
Mission critical transaction processing systems where uptime is essential
Upgrade or refurbishment projects of existing 1747-hc2 chassis to extend service life

This IBM midplane delivers the performance, reliability, and flexibility needed for modern enterprise workloads while ensuring easy installation and maintenance within the 1747-hc2 ecosystem.