Name: Heatsink Fan and Shroud Assembly
Brand: IBM
Price: 17.95 USD
Availability: InStock

IBM 03T9636 Heatsink Fan and Shroud Assembly

The IBM 03T9636 Heatsink Fan and Shroud Assembly is a precision engineered cooling solution designed to keep high-performance processors operating within optimal temperature ranges. This integrated unit combines a high-efficiency fan, a machined alum... Read More

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$17.95

In Stock: 1
Manufacturer: IBM
Model or Part: 03T9636
Condition: Refurbished
Weight: 2.00lb

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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview
The IBM 03T9636 Heatsink Fan and Shroud Assembly is a precision engineered cooling solution designed to keep high-performance processors operating within optimal temperature ranges. This integrated unit combines a high-efficiency fan, a machined aluminum heatsink, and a molded shroud that directs airflow exactly where it is needed. Built to IBM specifications, the assembly offers reliable thermal management for demanding server and workstation environments.

Key Features

Optimized blade design delivers quiet yet powerful airflow up to 4000 RPM
Aluminum fins provide excellent heat dissipation with low weight
Molded shroud creates a focused air stream that reduces hot spots on the CPU die
Secure mounting system compatible with standard IBM socket configurations
Easy installation with pre-drilled holes and alignment tabs

Technical Specifications

Part number: 03T9636
Fan size: 80 mm x 80 mm x 25 mm
Airflow: up to 40 CFM (cubic feet per minute)
Static pressure: 2.5 mm H2O
Operating voltage: 12 V DC
Connector type: 3-pin PWM
Heatsink material: anodized aluminum
Maximum operating temperature: 85 deg C
Weight: 0.45 lb (approx.)

Applications
The IBM Heatsink Fan and Shroud Assembly is ideal for use in data center servers, high-density blade systems, enterprise workstations, and any platform that requires sustained processing power with reliable cooling. It is particularly suited for Intel Xeon and AMD EPYC processors that are deployed in mission critical workloads where thermal stability directly impacts system uptime and performance.