Name: Heat Sink X260, x460, x366
Brand: IBM
Price: 58.95 USD
Availability: InStock

IBM 26K8805 Heat Sink X260, x460, x366

price

$58.95

Ships next business day.

In Stock: 41
Manufacturer: IBM
Model or Part: 26K8805
Condition: Refurbished
Weight: 3.00lb

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Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview

The IBM Heat Sink X260, X460 and X366 series (part number 26K8805) delivers high performance thermal management for demanding server and mainframe environments. Engineered with precision fin geometry and advanced copper alloy construction, these heat sinks efficiently dissipate heat from critical processors, memory modules and power supplies. Designed to fit IBM chassis specifications, they provide reliable cooling while maintaining a compact footprint.

Key Features

Optimized fin density for maximum airflow and heat transfer
High conductivity copper base with aluminum fins for lightweight design
Secure mounting system compatible with IBM X260, X460 and X366 platforms
Easy installation with tool-less clips and pre-drilled holes
Robust construction resistant to corrosion and thermal fatigue

Technical Specifications

Base material: Copper alloy (CuNi)
Fin material: Extruded aluminum
Dimensions (L x W x H): 120 mm x 100 mm x 45 mm (varies by model)
Thermal resistance: 0.30 deg C/W typical
Operating temperature range: -20 to 85 degrees Celsius
Weight: Approx 1.2 kg per unit
Compliance: IEC 60529 IP30 protection rating

Applications

IBM System x260, x460 and x366 servers
High-density blade and rackmount installations
Enterprise data center cooling solutions
Critical workload processing units requiring stable thermal performance
Upgrade or replacement of legacy heat sinks in IBM platforms

This IBM Heat Sink series provides the reliability and efficiency needed to keep your mission-critical hardware operating at optimal temperatures, reducing downtime and extending component life.