Name: X336 Heat Sink
Brand: IBM
Price: 54.95 USD
Availability: InStock

IBM 33P2385 X336 Heat Sink

The IBM X336 Heat Sink (part number 33P2385) is a high-performance thermal management component designed to keep critical processors and power modules operating within safe temperature limits. Engineered with precision-milled aluminum fins and an opt... Read More

price

$54.95

In Stock: 2
Manufacturer: IBM
Model or Part: 33P2385
Condition: Refurbished
Weight: 3.00lb

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Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview

Key Features

High thermal conductivity aluminum construction for rapid heat transfer
Fin geometry tuned for maximum airflow efficiency
Low profile design compatible with standard mounting brackets
Integrated pressure pads to ensure uniform contact with the chip surface
Durable finish that resists corrosion and oxidation over long service life

Technical Specifications

Model/Part Number: 33P2385
Material: Extruded aluminum alloy
Dimensions (L x W x H): 120 mm x 100 mm x 30 mm
Fin count: 180 fins
Thermal resistance: approx 0.35 deg C per watt
Maximum operating temperature: up to 85 degrees Celsius
Weight: 350 grams
Mounting interface: Standard IBM CPU socket with four screw holes

Applications

Enterprise servers and blade systems requiring efficient heat dissipation
High-density compute clusters where space is limited
Industrial control units that operate continuously under load
Networking equipment such as routers and switches with high throughput demands
Custom workstations built for scientific computing or data analytics

This heat sink combines robust construction with superior thermal performance, helping you maintain system stability while extending the lifespan of your critical components.