Name: System x306m CPU Heatsink
Brand: IBM
Price: 18.95 USD
Availability: InStock

IBM 39M4356 System x306m CPU Heatsink

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$18.95

In Stock: 4
Manufacturer: IBM
Model or Part: 39M4356
Condition: Refurbished
Weight: 3.00lb

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Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview

The IBM System x306m CPU Heatsink (part number 39M4356) is a precision engineered cooling solution designed to maintain optimal processor temperatures in the IBM System x306m server platform. Constructed from high conductivity aluminum and featuring an integrated fan mount, this heatsink delivers reliable thermal performance while fitting seamlessly into the original chassis layout.

Key Features

Optimized fin geometry for maximum airflow and heat dissipation
Heavy-duty mounting brackets ensure secure attachment to the CPU socket
Compatible with standard 80mm server fans for flexible cooling configurations
Designed for easy installation and removal, reducing service downtime
Durable finish resists corrosion and wear in demanding data centre environments

Technical Specifications

Model / Part Number: 39M4356
Material: Anodized aluminum base with copper heat pipes (if applicable)
Dimensions (L x W x H): 120 mm x 100 mm x 45 mm
Weight: approx 0.5 kg
Maximum CPU TDP support: up to 95 watts
Fan mounting options: standard 80mm fan, optional 92mm fan
Operating temperature range: 0 deg C to 45 deg C ambient

Applications

IBM System x306m servers used in small and medium business environments
Virtualisation hosts that require stable processor performance under load
High-availability clusters where thermal reliability is critical
Upgrade projects replacing aging cooling components to extend server life
Laboratory test rigs that need precise temperature control for IBM x306m CPUs

This heatsink provides the balance of performance, durability and ease of service that IT professionals expect from IBM solutions. By maintaining lower processor temperatures, it helps protect system stability, reduces throttling risk and can contribute to longer component lifespan.