Name: X3400/3500 M3 Heat Sink
Brand: IBM
Price: 24.95 USD
Availability: InStock

IBM 44X1745 X3400/3500 M3 Heat Sink

Manufacturer: IBM Model/Part Number: 44X1745 Product Name: X3400/3500 M3 Heat Sink Overview The IBM X3400/3500 M3 Heat Sink is a precision engineered thermal management component designed for high performance server and workstation platforms. It prov... Read More

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$24.95

In Stock: 2
Manufacturer: IBM
Model or Part: 44X1745
Condition: Refurbished
Weight: 3.00lb

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New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Manufacturer: IBM
Model/Part Number: 44X1745
Product Name: X3400/3500 M3 Heat Sink

Overview
The IBM X3400/3500 M3 Heat Sink is a precision engineered thermal management component designed for high performance server and workstation platforms. It provides reliable heat dissipation for the latest Intel Xeon processors, ensuring stable operation even under sustained workloads. Constructed from high conductivity aluminum alloy and featuring an optimized fin geometry, this heat sink delivers efficient airflow handling while maintaining a low profile that fits within tight chassis constraints.

Key Features

Advanced fin design for maximum surface area and improved convection
High conductivity aluminum alloy construction for rapid heat transfer
Integrated mounting system compatible with standard IBM server brackets
Low profile form factor suitable for dense rack or blade environments
Easy installation with pre-drilled holes and alignment guides

Technical Specifications

Part Number: 44X1745
Dimensions (L x W x H): 120 mm x 112 mm x 35 mm
Weight: approximately 0.85 kg
Material: Aluminum alloy, anodized finish
Thermal resistance: 0.45 deg C per Watt (typical)
Operating temperature range: -20 to 85 degrees Celsius
Compatible processors: Intel Xeon E5 v3/v4 series used in X3400 and X3500 M3 platforms

Applications

Enterprise data center servers requiring reliable cooling for multi-core CPUs
High performance computing nodes where thermal stability is critical
Blade or rackmount systems with limited airflow space
Upgrade projects for existing IBM X3400/X3500 M3 chassis to extend service life
Testing and development rigs that demand consistent temperature control

This heat sink provides the performance and durability needed to keep your mission critical systems running at peak efficiency, reducing thermal throttling and extending component lifespan.