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IBM 49Y0659 Hs22 Heatsink

IBM 49Y0659 Hs22 Heatsink
IBM 49Y0659 Hs22 Heatsink
The IBM Hs22 Heatsink (part number 49Y0659) is a high-performance thermal management solution designed for demanding server and data center environments. Engineered with precision aluminum fin construction, this heatsink efficiently dissipates heat f... Read More
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$46.95

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  • In Stock: 78
  • Manufacturer: IBM
  • Model or Part: 49Y0659
  • Condition: Refurbished
  • Weight: 3.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview

The IBM Hs22 Heatsink (part number 49Y0659) is a high-performance thermal management solution designed for demanding server and data center environments. Engineered with precision aluminum fin construction, this heatsink efficiently dissipates heat from critical components, ensuring reliable operation and extended system life.

Key Features

  • Optimized fin geometry for maximum airflow exposure
  • Lightweight yet robust aluminum alloy construction
  • Compatible mounting interface for standard IBM server boards
  • Easy installation with pre-drilled screw holes
  • Designed for operation in temperatures up to 85 deg Celsius

Technical Specifications

  • Model/Part Number: 49Y0659
  • Material: Extruded aluminum alloy
  • Dimensions (L x W x H): 120 mm x 80 mm x 45 mm
  • Fin density: 18 fins per inch
  • Thermal resistance: 0.35 deg C per Watt
  • Weight: 350 grams
  • Operating temperature range: -20 to 85 deg Celsius

Applications

  • Enterprise servers and blade systems
  • High-density data center racks
  • Network appliances requiring reliable cooling
  • Workstations that run intensive computational workloads
  • Any IBM platform that uses standard heatsink mounting points

The Hs22 Heatsink delivers consistent thermal performance, reducing hot spots and helping maintain optimal system efficiency. Its straightforward design and universal compatibility make it an ideal upgrade for organizations looking to improve cooling without redesigning existing hardware.