IBM 59Y4792 X3850 X5 Heatsink

IBM 59Y4792 X3850 X5 Heatsink
IBM 59Y4792 X3850 X5 Heatsink
The IBM X3850 X5 Heatsink (part number 59Y4792) is a high performance thermal management component designed for the IBM System x3850 X5 server platform. Engineered to dissipate heat from critical processors and chipset components, this heatsink helps... Read More
price
$24.95
  • In Stock: 10
  • Manufacturer: IBM
  • Model or Part: 59Y4792
  • Condition: Refurbished
  • Weight: 3.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview

The IBM X3850 X5 Heatsink (part number 59Y4792) is a high performance thermal management component designed for the IBM System x3850 X5 server platform. Engineered to dissipate heat from critical processors and chipset components, this heatsink helps maintain optimal operating temperatures, improve system reliability and extend the life of your investment.

Key Features

  • Precision engineered aluminum fins for maximum airflow efficiency
  • Integrated copper base for superior thermal conductivity
  • Low profile design fits within the compact server chassis
  • Easy installation with pre-drilled mounting holes and standard screws
  • Compatible with IBM X3850 X5 processor modules and chipset revisions

Technical Specifications

  • Part Number: 59Y4792
  • Material: Aluminum fins, copper base
  • Dimensions (L x W x H): 120 mm x 100 mm x 30 mm
  • Weight: approx 0.8 kg
  • Operating temperature range: -20 degrees to 85 degrees Celsius
  • Thermal resistance: <= 0.45 deg C/W

Applications

  • IBM System x3850 X5 servers in data center environments
  • High density blade and rack mounting solutions
  • Mission critical workloads that demand continuous uptime
  • Virtualization, cloud computing and database hosting platforms
  • Any upgrade or replacement scenario where reliable cooling is required

Upgrade your IBM server with the X3850 X5 Heatsink to ensure consistent performance, lower energy consumption and reduced risk of thermal throttling.