Name: X3550m4 Heat Sink
Brand: IBM
Price: 63.95 USD
Availability: InStock

IBM 81Y7335 X3550m4 Heat Sink

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$63.95

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In Stock: 11
Manufacturer: IBM
Model or Part: 81Y7335
Condition: New
Weight: 3.00lb

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Item Condition

New - Sealed or Open Box Condition
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Description

Overview

The IBM X3550m4 Heat Sink (part number 81Y7335) is a high-performance thermal solution designed specifically for the IBM System x3550 M4 server platform. Engineered to maintain optimal processor temperatures under heavy workloads, this heat sink delivers reliable cooling while fitting seamlessly into the existing chassis architecture. Its precision-machined fins and copper base provide efficient heat transfer, extending system uptime and protecting critical components.

Key Features

Optimized fin design for maximum airflow with standard IBM server fans
Copper base ensures low thermal resistance and rapid heat dissipation
Secure mounting brackets compatible with Intel Xeon E5-2600 v3/v4 processors used in the X3550 M4
Lightweight aluminum fin array reduces overall system weight without sacrificing performance
Easy installation using standard torque specifications for quick serviceability

Technical Specifications

Part Number: 81Y7335
Manufacturer: IBM
Base Material: Copper
Fin Material: Aluminum
Maximum Operating Temperature: up to 85 deg C
Dimensions (L x W x H): 120 mm x 110 mm x 30 mm
Weight: approx 0.45 kg
Compatible Processors: Intel Xeon E5-2600 series v3/v4
Required Fan Airflow: 40 CFM minimum per fan

Typical Applications

Enterprise data center servers that demand continuous high performance
Virtualization hosts running multiple virtual machines with sustained CPU load
High-performance computing clusters where thermal stability is critical
Remote or edge deployments where reliable cooling reduces maintenance intervals
Upgrade projects for existing IBM X3550 M4 systems seeking improved thermal headroom

By integrating the IBM X3550m4 Heat Sink into your server build, you ensure consistent processor temperatures, lower risk of throttling, and extended component life-all while maintaining the compact footprint required by modern rack environments.