Name: Rdny Midpl OC3/OC-12 Board
Brand: Juniper Networks
Price: 719.95 USD
Availability: InStock

Juniper Networks REDMID-OC/5/1 Rdny Midpl OC3/OC-12 Board

The Juniper Networks Rdny Midpl OC3/OC-12 Board (model REDMID-OC/5/1) is a high-performance optical interface module designed for midplane deployment in carrier grade routers and switches. Engineered to support both OC3 (155 Mb/s) and OC12 (622 Mb/s)... Read More

$719.95

Ships from outside of the USA. Please allow up to 2 weeks for delivery.

In Stock: 1
Manufacturer: Juniper Networks
Model or Part: REDMID-OC/5/1
Condition: Refurbished
Weight: 1.00lb

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Product Information

Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Description

Overview

Key Features

Dual mode operation supporting OC3 and OC12 rates on a single platform
Compact midplane form factor for efficient space utilization
Hot-swap capability minimizes downtime during maintenance
Built-in diagnostics and error monitoring for proactive network management
Compatible with Juniper Networks chassis that support the REDMID series

Technical Specifications

Interface types: OC3 (155 Mb/s) and OC12 (622 Mb/s)
Connector: Standard SC or LC optical connectors, configurable at install time
Power consumption: 8 watts typical
Operating temperature range: 0 to 70 degrees Celsius
Environmental rating: RoHS compliant, meets Telcordia standards
Dimensions: Midplane card size, 2U height

Applications

Metro Ethernet aggregation points where flexible bandwidth scaling is required
Carrier backbone nodes that need reliable OC3/OC12 transport links
Data center interconnects using optical fiber for high-speed server clustering
Enterprise WAN extensions that demand low latency and high availability
Network service providers seeking modular upgrades without replacing entire chassis

This board combines Juniper''s proven reliability with versatile speed options, making it an ideal choice for operators looking to expand capacity while maintaining a streamlined hardware footprint.