Oracle 7343396 M.2 Form Factor Carrier Assembly

Oracle 7343396 M.2 Form Factor Carrier Assembly
Oracle 7343396 M.2 Form Factor Carrier Assembly
The Oracle 7343396 M.2 Form Factor Carrier Assembly is a precision engineered platform designed to integrate multiple M.2 modules into a single, compact chassis. Built with high-grade materials and optimized for thermal performance, this carrier prov... Read More
price
$125.95
  • In Stock: 12
  • Manufacturer: Oracle
  • Model or Part: 7343396
  • Condition: Refurbished
  • Weight: 3.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

To bring you an even wider selection, some of our items are shipped directly from our trusted partners. Delivery times may vary for these items.

Overview

The Oracle 7343396 M.2 Form Factor Carrier Assembly is a precision engineered platform designed to integrate multiple M.2 modules into a single, compact chassis. Built with high-grade materials and optimized for thermal performance, this carrier provides reliable connectivity for enterprise storage solutions, networking cards, and accelerator devices. Its low profile design fits easily into standard rackmount servers, blade systems, and edge computing enclosures while maintaining easy access for installation and maintenance.

Key Features

  • Universal M.2 socket layout supports both B-key and M-key modules
  • Robust stainless steel frame with reinforced mounting points for vibration resistance
  • Integrated thermal pads and heat spreader to dissipate heat efficiently
  • Tool-free latch mechanism enables rapid insertion and removal of devices
  • High-speed PCIe 4.0 lanes ensure maximum data throughput
  • Compact dimensions compatible with 1U and 2U server bays

Technical Specifications

  • Model/Part Number: 7343396
  • Supported interface: PCIe Gen4 x4, SATA III (optional)
  • Maximum power consumption per slot: 7 watts
  • Operating temperature range: 0 to 55 degrees Celsius
  • Dimensions (L x W x H): 80 mm x 22 mm x 5 mm per carrier
  • Connector type: Gold-plated edge contacts for low resistance

Applications

  • Enterprise data center storage arrays requiring high density SSD deployment
  • High-performance computing nodes that need fast accelerator cards such as GPUs or FPGAs
  • Network infrastructure equipment using M.2 based NICs for low latency connectivity
  • Edge and IoT gateways where space constraints demand a compact, reliable solution
  • Blade servers and modular platforms seeking scalable storage expansion without redesigning the chassis

The Oracle M.2 Form Factor Carrier Assembly delivers a blend of durability, thermal efficiency, and ease of use that helps IT professionals maximize system performance while simplifying hardware management.