Telco Systems M6000-04-3-REV-B Chassis

Overview
The Telco Systems M6000-04-3-REV-B chassis is a robust, modular platform designed for high-density networking and transport applications. Built to support a wide range of line cards and service modules, this chassis delivers reliable performance in carrier, data center, and enterprise environments. Its flexible architecture allows easy scaling and rapid reconfiguration, making it an ideal backbone for evolving network infrastructures.

Key Features

• Modular design supports up to 16 slots for line cards, power supplies and fan modules
• Hot-swappable components reduce downtime during upgrades or maintenance
• Redundant power and cooling systems ensure continuous operation
• High capacity backplane with up to 12.8 Tbps throughput
• Integrated management interface with web GUI and CLI access
• Compliance with industry standards such as NEBS and RoHS

Technical Specifications

• Model number: M6000-04-3-REV-B
• Chassis dimensions: 44U height, 600 mm width, 1000 mm depth
• Weight: approximately 250 kg (empty)
• Power input: 1000 to 2400 V AC, 3 phase, 50/60 Hz
• Power consumption: up to 8 kW with full slot population
• Cooling: variable speed fans, 4 to 8 units depending on configuration
• Backplane capacity: 12.8 Tbps full duplex
• Operating temperature: 0 to 40 degrees Celsius
• Humidity: 10 to 90 percent non-condensing

Applications
The M6000-04-3-REV-B chassis is suited for a variety of demanding scenarios, including:

• Metro and long-haul transport networks
• Data center interconnect (DCI) solutions
• Carrier Ethernet aggregation
• IP/MPLS backbone deployments
• Enterprise WAN and branch office connectivity
• Network function virtualization (NFV) hosting platforms

With its scalable architecture, high performance backplane, and reliable redundancy features, the Telco Systems M6000-04-3-REV-B chassis provides a future-proof foundation for any high-capacity networking environment.