Cisco 700-45645 Heatsink Assembly for UCSC-C460-M4

Cisco 700-45645 Heatsink Assembly for UCSC-C460-M4
Cisco 700-45645 Heatsink Assembly for UCSC-C460-M4
The Cisco heatsink assembly (part number 700-45645) is designed for the UCSC-C460-M4 blade server. It delivers efficient thermal dissipation to keep critical components cool, ensuring stable operation and extending the life of your data center hardwa... Read More
price
$56.95

Ships next business day.

  • In Stock: 12
  • Manufacturer: Cisco
  • Model or Part: 700-45645
  • Condition: Refurbished
  • Weight: 3.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview

The Cisco heatsink assembly (part number 700-45645) is designed for the UCSC-C460-M4 blade server. It delivers efficient thermal dissipation to keep critical components cool, ensuring stable operation and extending the life of your data center hardware.

Key Features

  • Precision-engineered aluminum fins maximize airflow and heat transfer
  • Direct fit for UCSC-C460-M4 eliminates need for modifications
  • Lightweight construction reduces overall system weight without sacrificing durability
  • Easy installation with standard mounting brackets and hardware
  • Compatible with Cisco Unified Computing System cooling policies

Technical Specifications

  • Part Number: 700-45645
  • Manufacturer: Cisco
  • Material: High-grade aluminum alloy
  • Dimensions (L x W x H): 120 mm x 100 mm x 30 mm
  • Operating temperature range: 0 to 85 deg C
  • Weight: approx 1.2 kg
  • Connector type: Standard UCS thermal interface

Applications

  • UCS blade servers in high-performance computing clusters
  • Enterprise data centers requiring reliable cooling for dense workloads
  • Virtualization platforms that generate sustained CPU and memory heat
  • Edge deployments where space constraints demand compact thermal solutions

By integrating this heatsink assembly, you can maintain optimal thermal conditions, reduce the risk of overheating, and support continuous uptime for mission-critical applications.