IBM 00KC911 Heatsink Low-t Case X350 M5

IBM 00KC911 Heatsink Low-t Case X350 M5
IBM 00KC911 Heatsink Low-t Case X350 M5
The IBM Heatsink Low-t Case X350 M5 is a precision engineered thermal solution designed for high-performance computing environments where space constraints and cooling efficiency are critical. Built with advanced low-profile design principles, this h... Read More
price
$39.95
  • In Stock: 161
  • Manufacturer: IBM
  • Model or Part: 00KC911
  • Condition: Refurbished
  • Weight: 3.00lb
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Item Condition

New - Sealed or Open Box Condition
Excellent - Almost-New, Missing Original Packaging
Refurbished - Seller Refurbished, Good Condition, Previously Used Item

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Overview

The IBM Heatsink Low-t Case X350 M5 is a precision engineered thermal solution designed for high-performance computing environments where space constraints and cooling efficiency are critical. Built with advanced low-profile design principles, this heatsink delivers reliable heat dissipation while fitting into compact chassis without sacrificing airflow or stability.

Key Features

  • Low-height profile optimized for dense server racks and blade systems
  • High conductivity copper base with anodized aluminum fins for maximum thermal transfer
  • Integrated mounting system compatible with standard IBM X350 motherboards
  • Pre-finished surface treatment to resist corrosion and dust accumulation
  • Engineered for quiet operation with low fan speed requirements

Technical Specifications

  • Base material: Copper (purity 99.9%)
  • Fin material: Aluminum alloy
  • Overall height: 45 mm (approx.)
  • Thermal resistance: 0.35 deg C/W (typical)
  • Maximum operating temperature: 85 degrees Celsius
  • Weight: 250 grams
  • Mounting interface: Standard X350 socket with four screw points
  • Compliance: RoHS and REACH

Applications

  • High-density data center servers where space is at a premium
  • Blade and modular systems requiring efficient heat removal in limited volumes
  • Enterprise storage arrays that generate sustained thermal loads
  • Industrial computing platforms operating in confined enclosures
  • Research clusters needing reliable, low-profile cooling solutions

The IBM Heatsink Low-t Case X350 M5 combines robust construction with a slim footprint, making it an ideal choice for organizations that demand consistent performance and thermal stability without compromising on space efficiency.